Intel Corporation and Mitsubishi Electric Corporation (Mitsubishi) today announced they will co-develop a cellular chipset for the third-generation (3G) wireless technology market.
Intel and Mitsubishi explained they will work together to develop and market the new chipset and associated software as Japan deploys 3G wireless technology. Work on the chipset has begun, and the companies intend to expand their joint development effort to other geographic regions using the same platform architecture.
"Intel is committed to being a leading-edge wireless building block supplier. Today's announcement of a new chipset solution, developed by Intel and Mitsubishi, further demonstrates our ability to provide competitive solutions to the wireless marketplace," said Ron Smith, vice president and general manager of Intel's Wireless Communications and Computing Group.
"Using Intel's wireless solutions, Mitsubishi can develop a high-performance, low-power and highly integrated multimedia 3G cellular phone. Japan is our initial focus market, and we expect to use the same architecture platform for Europe and other regions in a timely manner," said Michio Nakanishi, group president of the Communication Systems Group, Mitsubishi Electric Corporation.
Intel's Wireless Building Blocks
Intel announced its commitment to wireless communications with the formation of its Wireless Communications and Computing Group in December 1999. The group focuses on cellular and wireless communications, providing building blocks for computing and wireless communication devices and data applications in the growing cellular market. Intel's wireless direction includes building on core businesses, such as its industry-leading flash memory technology; cellular chipsets; high-performance, low-power processors; and digital signal processing activities. Additionally, Intel has opened Intel(r) Wireless Competence Centers in Sweden, Japan and China to work with regional industry leaders on developing wireless solutions.