Samsung unveils multi-chip package device for 3G mobile phones Posted: 21-Dec-2000 [Source: Electronic Buyers' News] [Samsung developing larger memory chip for better multi-media for 3G handsets.] "Samsung Electronics is sampling a multi-chip package device that stacks a 64Mb NAND-type flash memory chip and an 8Mb static random access memory (SRAM) chip together for use in third generation (3G) mobile phones."Wireless handsets currently have 16Mb or 32Mb NOR-type flash memory built-in, but the wireless Internet access capabilities of 3G handsets necessitates an increased flash memorycapacity to store music files, still picture data and other applications, Samsung said. More...
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