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Samsung unveils multi-chip package device for 3G mobile phones
Posted: 21-Dec-2000 [Source: Electronic Buyers' News]

[Samsung developing larger memory chip for better multi-media for 3G handsets.]

"Samsung Electronics is sampling a multi-chip package device that stacks a 64Mb NAND-type flash memory chip and an 8Mb static random access memory (SRAM) chip together for use in third generation (3G) mobile phones.

"Wireless handsets currently have 16Mb or 32Mb NOR-type flash memory built-in, but the wireless Internet access capabilities of 3G handsets necessitates an increased flash memorycapacity to store music files, still picture data and other applications, Samsung said.


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