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TSMC and ZEEVO Deliver Fully Integrated Single-Chip Bluetooth Devices
Posted: 16-Jan-2001 [Source: TSMC press release]

[Single chip Bluetooth system uses mixed signal RF-CMOS technology.]

Hsinchu, Taiwan -- Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world's largest dedicated semiconductor foundry, today announced that it has delivered its first 0.18-micron Bluetooth silicon that combines RF, analog and digital baseband functionality in one single chip. TSMC's advanced 0.18-micron mixed-signal RF-CMOS process provides the platform for developers of cutting-edge Bluetooth communications applications.

Zeevo, Inc. is a system-on-chip (SOC) company based in the Silicon Valley, which develops solutions for advanced wireless applications. Enabled through the use of TSMC's 0.18-micron process, Zeevo is positioned to become a leading supplier of highly integrated, high performance, high value Bluetooth devices. Zeevo expects to announce their Bluetooth product, which includes the device along with full software and development support, during Quarter 1 of 2001.

"We are excited and confident because TSMC's 0.18-micron process enables us to create more sophisticated SOC products for enhanced wireless applications such as Bluetooth," said Anil Aggarwal, CEO of Zeevo, Inc. "We are pleased to be the first to make use of TSMC's advanced mixed-signal process." Mr. Aggarwal continued: "Our relationship with TSMC extends beyond vendor/supplier to a true partnership which will enable Zeevo to dominate the Bluetooth market, and our future product areas."

"Developers are successfully producing chips using our 0.25- and 0.35-micron mixed-signal, RF-CMOS processes. With our announcement of the first 0.18-micron Bluetooth wafers out, TSMC is providing a cost-effective technological advancement that increases design density and reduces time-to-volume," said John Chern, director of logic technology product marketing for TSMC. "By providing multiple processes for Bluetooth applications, with accompanying design kits that speed-up design times, we're enabling designers to enter the wireless communications markets faster, and with next-generation technology."

"Chip shipments for Bluetooth-enabled products will begin to pick up in the fourth quarter, and escalate rapidly in 2001. By 2005, this semiconductor market opportunity will approach $5 billion," according to Joyce Putscher, Director at In-Stat, Inc. a leading market research company in Scottsdale, Arizona.


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