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Intel Unveils Advances In Technology For Cell Phones
Posted: 16-Oct-2002 [Source: Intel press release]

[Intel introduces new high-end chips for cell phones allowing manufacturers to reduce size while increasing computing power, data storage capacity and battery life.]

Taipei, Taiwan -- Intel Corporation today announced several advances in memory and processing technologies that will help to significantly improve battery life, performance and storage capacity for cell phones.

The latest additions to Intel's lineup of leadership technologies include the world's first 1.8 volt multi-level cell wireless flash memory chip based on .13-micron process technology. In addition, Intel is delivering new microprocessors using innovative packaging technology that "stacks" memory and processor chips together, bringing powerful computing and memory capabilities in a single system package designed specifically for wireless devices based on the Intel(r) Personal Internet Client Architecture (Intel PCA).

"The convergence of voice and data in the wireless industry is requiring new innovation in silicon technology," said Ron Smith, senior vice president and general manager, Intel Wireless Communications and Computing Group. "In addition to longer battery life and higher performance, we have to address size and space issues. Intel is using its unique microprocessor and flash memory manufacturing and packaging expertise to develop and deliver some very compelling, breakthrough technologies to the wireless handset market." Smith made the announcement at the Intel Developer Forum in Taipei.

First 1.8 Volt Multi-Level Cell Wireless Flash Intel today introduced the 1.8-volt Intel StrataFlash Wireless Memory, which incorporates the company's new low-power, multi-level cell flash memory technology for wireless devices. The new product is the first in the industry to combine fast data access with Intel StrataFlash technology, doubling the amount of data in a single memory cell (multi-level cell) for higher performance and greater data storage. It is the first to be produced on industry-leading .13 micron process technology, and is the industry's first multi-level cell flash memory to run at 1.8 volts, drawing nearly 40 percent less power than the industry's previous low-power leader. The new memory technology is available in 64, 128 and 256 Mb densities.

In addition, Intel will use an innovative memory stacking technique called "stacked chip scale packaging." This allows Intel to stack up to four individual 1.8-volt Intel StrataFlash Wireless Memory devices to achieve storage densities of up to 1 Gb of code and data - making it the first 1.8 volt, 1 Gb component in a single package. Providing greater memory density in smaller space is a key advantage in helping to lower system cost, reduce overall board space and increase system reliability for cell phone designers, according to Smith.

New "System-in-a-Package"

Intel's "system-in-a-package" technology is being implemented in new products announced today in the form of the Intel PXA261 and Intel PXA262 microprocessors, which are specifically designed for data-enabled wireless handsets based on Intel PCA. The new processors place an Intel XScale technology based processor directly on top of Intel StrataFlash memory chips in a single package.

Stacking advanced computing and memory capabilities in a "system-in-a-package" design reduces the number of components in a cell phone and enables manufacturers to create new and different cell phone designs and form factors.

The processors will provide new features for cell phone users including better ability to execute such performance-intensive applications as MPEG4 video decode, speech and handwriting recognition, and running Java software.

The Intel PXA261 processor (200 MHz) stacks a single 128 Mb Intel StrataFlash memory chip with the processor for 56 percent space savings, while the Intel PXA262 processor (200 MHz and 300 MHz) stacks two 128 Mb Intel StrataFlash memory chips for 256 Mb of memory and 65 percent less space than stand-alone products.

Pricing and Availability All of these new chips are key components of Intel PCA, Intel's development blueprint for designing wireless handheld communication devices that combine voice communications and Internet access capabilities.

Both the Intel PXA261 and Intel PXA262 applications processors are available today in sample quantities with production volumes expected in the first quarter of 2003. Products using the new processors will be available early next year. The Intel PXA261 processor at 200MHz/128Mb has a suggested list price of $36.10 (US), and the Intel PXA262 processor at 200 and 300 MHz/256 Mb has a suggested list price of $54.60 and $62.60 in 10,000 unit quantities, respectively. More information on the new processors can be found at http://www.intel.com/go/ap.

Development cards (DCPXA26x Processor Family), used to help enable the rapid development and prototyping of hardware and software built around the Intel PXA261 and Intel PXA262 processors, are available for the Intel DBPXA250 development system.

1.8 Volt Intel StrataFlash Wireless Memory is currently available in 128 Mb densities for sampling, with production volumes expected in the second quarter of 2003, and has a suggested price of $17.75 in 10,000 unit quantities. More information on 1.8 Volt Intel StrataFlash Wireless Memory can be found at http://developer.intel.com/design/flcomp/prodbref/251890.htm.

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