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Qualcomm Licenses USB On-The-Go Technology from TransDimension for 3G Chipsets
Posted: 12-Nov-2002 [Source: Qualcomm press release]

[TransmDimension's USB On-The-Go technology allows wireless connectivity between leading edge 3G wireless terminals and numerous USB devices.]

San Diego and Irvine, Calif. -- QUALCOMM Incorporated, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and TransDimension, a privately held company that develops and markets connectivity solutions based on Universal Serial Bus (USB) and Bluetooth(tm) technologies, today announced the licensing by QUALCOMM of TransDimension's USB On-The-Go (OTG) technology.

USB is a serial interface that allows communication between hosts such as PCs and peripherals. As more portable devices adopt the USB interface, direct connectivity - without a PC as an intermediary - has become a necessity. The OTG Supplement to the USB 2.0 Specification defines several enhancements that address the growing need for mobile connectivity, including a USB peripheral with host capability to communicate with other selected USB peripherals, a mobile-form-factor USB connector, and low-power capabilities to preserve battery life. Wireless handsets using QUALCOMM chipsets that incorporate the OTG technology will enable access to a multitude of existing USB devices - including accessories such as printers, digital cameras, keyboards, audio players and CD-ROMs.

"QUALCOMM is committed to providing our customers with the most cost-effective and highly integrated 3G wireless solutions in the industry," said Don Schrock, president of QUALCOMM CDMA Technologies. "Partnering with TransDimension and integrating its complete OTG solution into QUALCOMM products will enable a new generation of connectivity between leading-edge third-generation (3G) wireless terminals and numerous USB devices."

"We are proud QUALCOMM has chosen our technology to bring innovative new connectivity features like OTG to their next-generation chipsets," said Rick Goerner, CEO of TransDimension. "We were able to offer the industry's most complete OTG solution, consisting of our USB OTG Controller IP Core, USBLink OTG software and class drivers, and we are pleased that QUALCOMM is making it part of their overall connectivity solution."


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