[The RTR6200 chip supports dual-mode, quad-band GSM transceiver operations and UMTS transmit operations helping enable worldwide roaming for UMTS terminals.]

San Diego, Calif. -- QUALCOMM Incorporated, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the radioOne(tm) RTR6250(tm) chip, a fully integrated transceiver/transmitter for UMTS (WCDMA) and GSM systems. The RTR6250 device, which features radioOne Zero Intermediate Frequency (Zero IF) architecture, interfaces directly with QUALCOMM's MSM6250(tm) Mobile Station Modem (MSM) baseband processor and supports dual-mode, quad-band GSM transceiver operations [GSM 900, Digital Cellular System (DCS) 1800, and GSM 850 and 1900] and UMTS transmit operations for 1900 MHz and 2100 MHz.

"By adding GSM 850 and 1900 MHz capabilities to the RTR6200 chip, the RTR6250 chip will help enable worldwide UMTS and GSM roaming," said Don Schrock, president of QUALCOMM CDMA Technologies. "This increases the already high level of integration that the RTR6200 device enabled, and will enhance the cost-effective 3G solution that QUALCOMM offers to manufacturers of handsets for the UMTS and GSM marketplace."

QUALCOMM's radioOne ZIF architecture eliminates the need for IF components - including IF chipsets, IF Surface Acoustic Wave (SAW) filters and IF voltage controlled oscillators (VCOs) - thereby reducing printed-circuit-board area and bill-of-material costs for future wireless handsets and other devices, enabling more cost-effective multimode, multiband phones.

The RTR6250 GSM receivers consist of LNAs, direct conversion mixers and filtering, while the GSM transmitters consist of an upconversion modulator and offset phase locked loop (PLL). The RTR6250 UMTS transmitter includes the I/Q upconversion modulator, UHF PLLs and a transmit VCO.

The UMTS receive function in the MSM6250 chipset, performed by the RFL6200 LNA and the RFR6200 chip, contains the direct conversion mixer and local oscillator (LO) generator.

The RTR6250 chip is fabricated with a silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process, thus permitting high linearity and low power consumption, and is available in an 8X8 mm bump chip carrier 56-pin Quad Flat No-Lead (QFN) package.

The MSM6250 chipset solution supports data rates of up to 384 kbps and is compatible with the advanced feature set of QUALCOMM's Launchpad(tm) suite of technologies, including MPEG-4 video encoding/decoding, fast JPEG encoding/decoding, MP3 audio decoding, a 2D/3D graphics accelerator for advanced gaming applications, a MIDI synthesizer and a megapixel digital camera interface.

Samples of the RTR6250 chipset are expected to be available in the third quarter of calendar 2003.

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