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Philips introduces next-generation LTPS Mobile Display
Posted: 20-Aug-2003 [Source: Phillips]

[Philips introduces the highly integrated LTPS (low temperature polysilicon) system module for next-generation mobile phone applications.]

Royal Philips Electronics of the Netherlands (AXE: PHI; NYSE: PHG), one of today's leading providers of mobile display technology, today introduced the latest addition to its line up of active matrix liquid crystal displays (AMLCDs)-a highly integrated, low temperature polysilicon (LTPS) system module for next-generation mobile phone applications. This breakthrough active matrix solution features a highly optimized architecture with a DC/DC converter embedded on the actual glass-enabling the production of performance-packed, ultra-low power mobile phone devices with extremely small form factors.

The majority of AMLCDs produced today, including those manufactured by Philips, utilize amorphous silicon (a-Si). However, Philips' latest solution leverages LTPS (known for greatly improving transistor performance)-allowing for the integration of many of the circuitry functions onto the actual glass substrate. This functional integration capability results in lower integrated circuit (IC) costs, a reduced number of components and tighter display margins.

Commenting on the newest addition to the company's extensive AMLCD portfolio, Peter Hopper, CEO for Philips Mobile Displays Group, noted, "Our LTPS solution is indicative of our continual commitment to providing our OEM customers with the most comprehensive portfolio of display solutions that best suits their respective needs. With our strengths in both module and system design, we are in a solid position to be the technology partner of choice to today's mobile device manufacturers. With our highly integrated display solutions that deliver added value and functionality, we can help OEMs speed time to market of cutting-edge mobile products, along with simplifying system integration and lowering costs."

Specifically with Philips' new LTPS LCD module, the majority of the DC/DC converter is directly embedded onto the actual glass, thereby only requiring a single supply voltage. By integrating the DC/DC IC and many of the external capacitors directly onto the glass itself, the result is a highly optimized and efficient mechanical design. Furthermore, the interfacing requirements are entirely standard so that OEMs can employ this highly integrated module within their respective mobile phone applications in a "plug & play" fashion. Philips reports that its LTPS active-matrix solution will be available for production by the end of Q4 2003.

Philips continues to demonstrate enhancements to its LTPS capabilities. Case in point, the extremely efficient architecture and design of the embedded DC/DC converter is based on a previous 'system-on-glass' design demonstrated by the company during SID 2001. Other key features of this new module include:

* 18-bit data, 262k colors, normally white;

* DC/DC and gate driver on LTPS panel;

* Resolution: 176xRGBx220;

* Contrast ratio: 100:1 (transmissive); 10:1 (reflective); and

* Brightness: 150 cd/m2

Today's announcement follows on the heels of another Philips' breakthrough in the AMLCD arena. The company recently unveiled a transmissive, a-Si thin film transistor (TFT)-LCD color solution for the telecommunications market that delivers superior contrast, color saturation and brightness capabilities for 'clamshell-style' mobile phones. Both of these recent breakthroughs compliment the company's AMLCD portfolio, which also includes reflective and transflective technologies-further positioning the company as an established leader in the TFT arena across all its served markets, including telecommunications, smart handheld, automotive and avionics.

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