Topics Mobile Tech News Monday, December 18

Headlines

Contact us


Site search:
complete archives list




Site Sponsors:


Don't forget AT&T and Verizon promo codes at Sidepon.com to save money.


NEC Launches World's Smallest Camera Phone
Posted: 03-Feb-2004 [Source: NEC]

[NEC to launch ultra-compact GPRS phone equipped with a 1.8 inch TFT color display and a digital camera this month in the Chinese market.]

Tokyo -- NEC Corporation today announced that it has succeeded in creating a card-shaped, camera-equipped mobile phone, which it will launch on the China market, one of the world's largest and most competitive mobile markets, in February, 2004.

NEC's own cutting-edge technology has enabled an ultra-compact, attractively packaged mobile phone boasting measurements of 85mm (width) X 54mm (height) X 8.6mm (depth), and a light weight of 70g. This mobile-internet product supports GSM/GPRS, and is equipped with a 1.8 inch (120 X 160 dot) TFT color display and a digital camera (300,000 pixels). Loaded with 40-polyphonic ring tones, and installed with camera functions including a mobile light, and consecutive shooting ability etc, this phone is used in conjunction with an earphone and a mike.

"This world's smallest and slimmest mobile phone is a symbolic flag-ship product representing NEC's leading position in mobile terminal technology," said Yoshiharu Tamura, General Manager of Mobile Terminals Division, NEC Corp. "NEC will continue to offer new, innovative mobile terminal solutions, which offer compact shape, and the latest product technologies, allowing users use of a variety of mobile phones for different situations."

"By combining NEC's competence in mobile and basic R&D technology, we can realize completely new-concept mobile phones" said Hisatsune Watanabe, Associate Senior Vice President and Executive General Manager of Central Research Laboratories, NEC Corp. "Ultra-slim mounting technology is an important and constant R&D theme for NEC."

Together with NEC in Japan, the Mobile Terminals Development Center based in Beijing, China, has significantly contributed to product planning and in enabling this competitive product to be brought to the market.

This product has been realized through the following: - Multi-layered slim structure. - Slim and highly stiff case structure. - Thin printed circuit board.

Along with a slim case, this product also boasts a slim structure that was realized through optimized space layout of stackable function modules (circuit board, display, key-sheet, battery, and embedded antenna). High stiffness was enabled by a compound structure of metal and resin. NEC also developed new thin printed circuit board by decreasing thickness by approximately 40%. In addition, equipment reliability is heightened through stress reduction realized by our original process technology. The core LSI employs very small CSP (Chip Size Package), and the most advanced high-density surface mounting technology.

NEC intends to further advance this technology toward broader application use in areas such as mobile terminals, PDAs and micro PCs etc.

More...

Back to Headlines...

Apple Watch Apple Watch

iPhone 6 and iPhone 6 Plus iPhone 6 and iPhone 6 Plus

Amazon Fire Amazon Fire

Samsung Z - Tizen Samsung Z - Tizen

LG G3 LG G3

HTC One mini 2 HTC One mini 2

OnePlus One OnePlus One

HTC One (M8) HTC One (M8)

Samsung Gear 2 Tizen Watch Samsung Gear 2 Tizen Watch

HP VoiceTab HP VoiceTab

T200 octa-core T200 octa-core

Nokia 2520 Tablet Nokia 2520 Tablet

Samsung Galaxy Round Samsung Galaxy Round

BlackBerry Z30 BlackBerry Z30

iPhone 5S and iPhone 5C iPhone 5S and iPhone 5C

Samsung Galaxy Mega Samsung Galaxy Mega

Sony SmartWatch 2 Sony SmartWatch 2

iOS 7 iOS 7

Jolla Jolla

BlackBerry Z10 BlackBerry Z10

Galaxy S 4 Galaxy S 4

Galaxy Note 8.0 Galaxy Note 8.0

Ubuntu on Tablets Ubuntu on Tablets

LG Optimus G Pro L-04E LG Optimus G Pro L-04E

Firefox OS Firefox OS

Sony Zperia Z Sony Zperia Z



 

Valid HTML 4.1!

RSS © 1999-2017 Traques LLC
All times recorded in UTC
webmaster@MobileTechNews.com