NTT DoCoMo, Inc. announced today that the company will invest in Renesas Technology Corp. to jointly develop a single-chip LSI for dual-mode handsets making FOMA(R) 3G handsets compatible with both W-CDMA and GSM/GPRS networks.
Currently, it is necessary to embed two chips in order to produce a W-CDMA and GSM/GPRS dual mode handset. However, by combining DoCoMo's W-CDMA technology with Renesas Technology's LSI fabrication, multimedia application processor and GSM/GPRS technologies, a single-chip will be developed that enables a lower cost 3G handset to run on both networks.
DoCoMo's investment is a step toward bringing about the widespread global use of 3G FOMA compatible handsets incorporating low-cost chipsets, and which feature an array of power-efficient advanced functions. Enhanced chipsets will also enable the upgrading of basic FOMA handset functions, such as longer standby-time.
DoCoMo will provide a total of about 7 billion yen over three years (fiscal 2004 to 2006) to Renesas Technology.
Major features of the new LSI are as follows.
1. Support for W-CDMA+GSM/GPRS dual-mode handsets
2. Baseband LSI and SH-Mobile application processor on a single chip
3. Use of SH-Mobile third-generation CPU core (development project name: SH-X) offering powerful multimedia application processing, including image, audio, and Java(tm) capabilities, together with low power consumption
The two companies plan to have a product ready in the first half of fiscal 2006. Renesas Technology will collaborate with NTT DoCoMo to offer handset manufacturers a platform based on the new LSI and promote worldwide use of FOMA services and reduce costs. Renesas Technology also plans to provide this single-chip LSI for UMTS* market.
*Note: UMTS (Universal Mobile Telecommunication System) The third generation mobile telecommunication system in Europe . European standard of telecommunication system compliant with IMT-2000 and its highest baud rate is 2Mbps.