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Joint 3G chip development announced by TI and DoCoMo
Posted: 13-Jul-2004 [Source: TI, NTT DoCoMo]

[TI and NTT DoVCoMo to collaborate on development of a multi-mode UMTS chipset for the worldwide 3G handset market based on TI's OMAP(tm) 2 architecture and NTT DoCoMo's W-CDMA technology, ]

Tokyo -- Texas Instruments Incorporated and NTT DoCoMo, Inc., announced today a joint agreement to develop a cost-competitive, multi-mode UMTS (W-CDMA/ GSM/GPRS) chipset to serve the Japanese, U.S. and worldwide 3G handset market. This collaboration further strengthens a long-standing relationship between the two industry leaders to drive the faster market adoption of 3G handsets. An integrated UMTS digital baseband and applications processor will be developed based on TI's OMAP(TM) 2 architecture and NTT DoCoMo's W-CDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide. Additionally, the agreement will include development and testing of power management, RF and protocol software that will be made available as system solutions to TI's worldwide customer base.

To be manufactured using TI's 90nm technology, this new UMTS solution will be the first to integrate TI's OMAP 2 applications processor with a digital baseband. TI's OMAP 2 "All-in-One" architecture provides the foundation for mobile device manufacturers to merge today's most compelling high-end consumer electronics in smartphones and other converged portable multimedia devices. OMAP 2 processors will re-define mobile entertainment and communications as the first solutions to deliver consumer electronics-quality user experiences to the wireless industry, such as digital TV, hi-fi music with 3D effects, up to DVD-quality video, high-end gaming console functionality, best-in-class color display, and digital cameras with up to 6 megapixels.

Expanding upon TI's existing UMTS chipset portfolio, TI will also develop a series of UMTS chipsets for the general market based on this solution with a roadmap encompassing multi-mode EDGE and higher data rate HSDPA offerings. The complete system solution will include the integrated digital baseband and OMAP 2 applications processor, as well as RF and power management devices.

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