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Variety of TD-SCDMA chipset solutions announced
Posted: 17-Nov-2004 [Source: Mobile Tech News]

[Several companies announced their variations of TD-SCDMA chipset solutions including Commit and TI, CEVA and Spreadtrum, and Analog Devices. ]

Mobile Tech News -- Chinas' contribution to the IUT's IMT-2000 specification for 3G services is TD-SCDMA (Time-Division Synchronous Code-Division Multiple Access). The standard is a strong contender in China's 3G licensing race. Although licenses were expected to be granted early next year, it is now likely the Chinese government won't grant licenses until later in the year. The 3GSM World Congress currently underway in Hong Kong has companies showcasing their TD-SCDMA chipset solutions in preparation for the expected windfall in China's 3G market.

Commit and TI are demonstrating a TD-SCDMA solution incorporating TI's OMAP(tm) multimedia processors and digital signal processing technology along with a 3G TD-SCDMA prototype handset. Through its cooperation with TI, Commit is able to provide a complete TD-SCDMA terminal solution compliant with 3GPP standards. Commit recently announced its complete chipset solution and architecture for TD-SCDMA terminals integrating TI technology. The complete chipset solution will be ready for mass production in 2005.

CEVA and Spreadtrum announced the development of a 3G TD-SCDMA mobile phone chipset powered by the CEVA Teak DSP Core. The Spreadtrum multi-band SC8800 chipset is the first complete wireless chipset for GSM/GPRS/TD-SCDMA standards. The chipset enables dual-mode 2G/3G phones to operate transparently over China's TD-SCDMA and GSM networks.

Analog Devices announced their complete chipset from a single supplier for developers of 3G mobile terminals based on the TD-SCDMA Low Chip Rate (LCR) air interface. Powered by ADI's Blackfin(R) Processor, the new SoftFone(R)-LCR Chipset provides all the critical functions necessary to build a TD-SCDMA handset.

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