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Motorola and TI expand joint initiative
Posted: 29-Jan-2007 [Source: Motorola]

[Motorola to include TI's 3G, WiMAX and OMAP technologies in new handsets expected to be available to consumers as early as 2008.]

Dallas -- Motorola and Texas Instruments (TI) today announced that the companies are expanding their strategic relationship to include 3G, WiMAX and OMAP(TM) technologies in the design and development of new, experience-optimized mobile devices. The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from both Motorola and TI.

As part of the expansion, Motorola is developing 3G handsets based on a TI customized 3G solution that will include high-performance, power-efficient processors from TI's OMAP 3 architecture, as well as advanced, unique 3G and 3.5G building blocks from both Motorola and TI. New handsets using this solution are expected to be available to consumers as early as 2008.

Additionally, TI is supporting Motorola's mobile WiMAX initiative, including development of a customized Motorola WiMAX solution, and providing digital design elements, high-performance analog components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.

To meet the growing need for affordable multimedia-rich capabilities in handsets, Motorola has also selected solutions from TI's OMAP 2 and OMAP 3 product portfolio and OMAP-Vox(TM) family, including the OMAPV1035 GSM/GPRS/EDGE single-chip solution from the "eCosto" platform and the OMAPV1030 GSM/GPRS/EDGE chipset. Motorola plans to use the OMAPV1035 solution, which leverages TI's innovative DRP(TM) technology, in new low-cost multimedia mobile devices expected to be in the market in 2008. Motorola also plans to use the OMAPV1030 chipset in new mid-range multimedia mobile devices expected to be in the market later this year.


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