Qualcomm Incorporated today announced that multiple network operators have committed to trialing HSPA+ technology this year. To be conducted with operators including Hutchison 3G, Telecom Italia, Telefonica and Telstra, the Company's HSPA+ trials bring the technology another step closer to commercialization. HSPA+ is a seamless upgrade from HSPA, delivering up to 28 Mbps mobile broadband and dramatic increases in network capacity without the need for new spectrum.
"HSPA+ provides a highly efficient path for network operators to provide next-generation wireless services with their existing networks," said Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies. "With trials this year, we are on track for commercialization in 2009, giving network operators the added benefit of time-to-market advantage in addition to advanced broadband capabilities."
"3 is committed to delivering a compelling experience to our customers," said Christian Salbaing, managing director of European telecommunications at Hutchison 3G Europe. "HSPA+ provides a clear path for us to evolve our existing high-speed networks to provide the best wireless broadband services through increased network capacity and the highest data speeds."
"Telecom Italia relies on HSPA technology to provide the most advanced services to its customers, and we are excited about the opportunities delivered by HSPA+," said Stefano Nocentini, head of Telecom Italia Lab. "We look forward to working with Qualcomm to validate and optimize HSPA+ technology this year, and to seeing the benefits it can enable for our subscriber base."
"Telstra's Next G network is fully enabled with HSPA, delivering to Australians a world-class wireless mobile and broadband experience," said Mike Wright, Telstra's executive director of wireless. "Our network is already the world's largest national 3GSM network and one of the fastest. Since its launch, rapid increases in 3G customer penetration have placed us among the world leaders, and this growth is enabled through a wide range of data-enabled content and services. We are committed to commencing the introduction of HSPA+ later this year and look forward to it further evolving the service with increased network capacity and higher data speeds."
The HSPA+ trials are expected to take place this year, enabling commercialization of the technology as early as 2009. The trials will use Qualcomm's Mobile Data Modem (MDM) MDM8200 chipset. Key features being trialed include 64-QAM HSDPA for 21 Mbps downlink data rates and 2x2 downlink MIMO for 28 Mbps downlink data rates.