[Samsung releases new products and introduces new 'smart' and 'green' solutions and its annual Mobile Solutions Forum.]

Taipei, Taiwan -- Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today held the sixth annual Samsung Mobile Solutions Forum at the Westin Taipei Hotel, where it highlighted major mobile device trends and shared insight into future mobile technologies.

Attended by more than 1,000 industry professionals including Samsung business partners and customers from handset, PDA and original design manufacturers, the annual event featured a “Smart and Green Mobility” theme that underscored the key milestones needed to be attained in improving component solutions for mobile devices.

“As a leader in international efforts toward greater ecological sustainability and ‘green’ awareness, Samsung Electronics is driving hard to further enhance the value to its products through the design of high-performance devices with minimal power requirements,” said Dr. Oh-Hyun Kwon, president, Semiconductor Business, Samsung Electronics.

“Samsung ‘smart’ and ‘green’ solutions are designed to influence and transform people’s lifestyles, while contributing to the greening of a wide range of information technology products entering the marketplace,” he added.

Speakers at the forum provided insight into the smarter and greener components that will serve as the fundamental starting point for tomorrow’s most advanced information technology and mobile devices. “The savviest companies will reconcile the inherent conflict between performance and power by pursuing continued innovation in both areas,” Dr. Kwon went on to say.

New Samsung products unveiled at the forum included the world’s fastest, low-power 1GHz application processor, a touch-embedded display driver IC (DDI), a quarter-inch 5-megapixel system-on-chip (SoC) image sensor, and a 65nm single-chip mobile TV channel decoder RF system-on-chip (SoC) compliant with China’s prevailing mobile broadcasting standard. Samsung officials also announced production availability of key advanced memory solutions: a 60nm-class 512-Megabit (Mb) phase-change random access memory (PRAM) and a proprietary 1-Gigabit (Gb) OneDRAMTM chip based on fusion memory technology.

Forum speakers stressed that the technology advancements of system LSI (large scale integration) devices, market implementation of low-power core technologies, reduction in chip sizes and the availability of advanced memory products featuring combined performance and power efficiencies, will all contribute significantly to greater user mobility, without sacrificing performance or increasing power consumption.

Samsung said its “Smart and Green Mobility” technologies, together with a new Samsung green memory educational campaign, should also help to raise awareness of the potential for major power savings in servers and a wide range of other applications.

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