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Infineon and Nokia Announce LTE Collaboration
Posted: 26-Nov-2009 [Source: Infineon]

[Infineon and Nokia are working together to develop next generation LTE transceiver chips.]

Neubiberg, Germany -- Infineon Technologies AG, one of the leading semiconductor companies for mobile phone solutions, and Nokia, the world’s largest manufacturer of mobile phones and services, today announced a cooperation to develop advanced radio frequency (RF) transceiver solutions. The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s advanced licensable baseband modem technologies and Infineon’s leading RF solutions.

Nokia and Infineon will work together to ensure that current and future generations of Nokia’s leading licensable modem designs work seamlessly with Infineon’s leading RF transceiver solutions, giving the industry access to complete modem solutions for HSPA (High Speed Packet Access) through LTE (Long Term Evolution) and beyond.

“We are grateful to expand our successful collaboration with Nokia beyond our current platform and RF activities,” stated Prof. Hermann Eul, Member of the Infineon Management Board. “Pairing Nokia’s advanced modem technology and Infineon’s best in class RF transceiver solutions, will give the industry access to very competitive chipset solutions.”

The collaboration involves teams from both companies working on the architectural and system challenges to ensure seamless interoperability and compatibility. The fruits of this cooperation will be a verified technology reference platform.

“Taking advantage of each company's expertise as leaders in their respective fields, this cooperation will help to deliver standard-based, industry leading solutions for mobile internet devices,” said Pekka Sarlund, Vice President, Wireless Modem, Nokia.

Facilitated by this cooperation, both companies will jointly drive the interface standardization for LTE-Advanced enabling data rates of up to 1Gbit/s. Providing a validated system with an open interface will enable a fast roll out of new products and increase competition in the market for advanced modem chipsets.

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