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Hynix America introduces chip-scale-packaged DRAM
Posted: 09-Aug-2001 [Source: The Korea Herald]

[Hyinx drives towards handset miniaturization with new DRAMs.]

"Hynix Semiconductor America Inc. introduced several high density DRAMs available in a FBGA (fine pitched ball-grid-array) package, Hynix Semiconductor Inc. said yesterday.

"The world's third largest chip maker said the new CSP (chip scale package) is targeted to meet the needs of customers utilizing small form factor packaging in applications such as PDAs (portal digital assistants), notebook PCs, smart phones, digital video and still cameras and wireless communications.

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