|Industry's First Standard CDMA2000 1xEv-DV Chipset Now Sampling|
Posted: 03-Jun-2004 [Source: TI]
[TI and STMicroelectronics announce new CDMA2000 1xEV-DV chipset delivering advanced multimedia services and high-speed Internet to 3G devices.]
Dallas and Taipei, Taiwan -- Accelerating the deployment of high-speed Internet and robust multimedia services to 3G mobile devices, STMicroelectronics and Texas Instruments Incorporated announced they are sampling the industry's first standard cdma2000(R)1xEV-DV solution. Considered a superior technology migration path for cdma2000 operators, the 1xEV-DV standard provides users with broadband capabilities via their cell phones, PDAs, and other mobile devices, enabling extremely high-speed Internet connectivity at ten times the speeds provided by current cdma2000 1X and GPRS solutions, while simultaneously supporting the voice capability of cdma2000 1X.
To ensure availability of devices and equipment ready for commercial deployment of 1xEV-DV technology, TI and ST are collaborating with Nokia for interoperability testing with South Korea-based LGE's infrastructure unit. This testing is in support of wireless operator LG Telecom's (LGT) planned commercial deployment of EV-DV services in South Korea.
"LGT believes 1xEV-DV is the right direction for cdma2000 advancement and is committed to the deployment and evolution of the standard. This solution from TI and ST is a key enabler for the deployment of advanced multimedia applications on LGT's 1xEV-DV network," said Dr. Youn-Kwan Kim, LGT vice president, Network Technology Standards.
Availability and Packaging
Samples of the 1xEV-DV solution are available now, supporting the 1xEV-DV Release C standard to meet immediate market requirements.
The TBB5160 is packaged in a 289-pin PBGA, the STw4200 in a 244-pin TFBGA, the TRF4320 in a 40-pin VQFN, and the TRF5320 in an 84-pin TFBGA.
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