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RF CMOS Processing Technology arrives in handsets
Posted: 02-Feb-2005 [Source: Qualcomm]

[RF-CMOS cost-effective semi-conductor processing technology allows handset manufacturers to supply cost-competitive handsets to emerging CDMA2000 1X markets.]

San Diego -- QUALCOMM Incorporated today announced at SuperComm India 2005 in New Delhi the first commercially available handsets enabled by Radio Frequency Complementary Metal Oxide Semiconductor (RF CMOS)-based chipsets in the Value Platform. Hisense, LGE and Samsung are among the global manufacturers who have introduced wireless devices based on QUALCOMM's Mobile Station Modem(TM) (MSM(TM)) MSM6000(TM) and MSM6025(TM) chipset solutions, which include cost-effective RF CMOS processing technology.

The first commercial devices based on RF CMOS technology will initially target leading emerging markets for CDMA2000(R) 1X, including India, China and Latin America, followed by additional markets in Southeast Asia and elsewhere. Several other manufacturers are also in advanced stages of product development using QUALCOMM's RF CMOS-based chipsets and are expected to be launching handsets in the second quarter of calendar 2005.

"With strong growth in our CDMA2000 1X customer base, new handset models based on QUALCOMM's RF CMOS chipsets will enable a wider range of price-competitive 1X devices that deliver superior voice quality, data features and form factors," said Kamal Nanavaty, chief operating officer of Wireless for Reliance Infocomm. "These handsets based on MSM6000 and MSM6025 will enable our manufacturer partners to deliver devices that address multiple market segments, appealing to a broader subscriber base with wireless multimedia, including SMS, poly-ringtone downloads and 3G data."

"CDMA2000 1X handsets enabled by QUALCOMM's RF CMOS based MSM6000 and MSM6025 chipsets will enable price-competitive, high-quality wireless services and allow us to create multi-tier service plans," said Milesh Ruparel, chief officer of Supply Chain Management for Tata Teleservices Limited. "With wireless service options for all market tiers and attractively priced 1X handsets enabled by QUALCOMM's chipset solutions, we look forward to continuing our successful regional growth."

"QUALCOMM's RF CMOS-based chipsets validate our RF technology leadership and offer emerging CDMA2000 1X markets a cost-effective path to 3G," said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. "These first commercially available RF CMOS handsets extend the global reach of 1X by providing carriers with highly competitive, entry-level next-generation solutions."

RF CMOS is a low-cost, high-volume digital process technology that allows wireless device manufacturers to leverage significant economies of scale across digital and RF products -- further driving down costs to supply cost-competitive wireless solutions to emerging CDMA2000 1X markets.

QUALCOMM's Value Platform includes the MSM6000, MSM6025, MSM6050(TM), MSM6200(TM) and MSM6225(TM) chipsets, enabling voice-centric and basic data phones and services for emerging and prepaid CDMA2000 1X and WCDMA (UMTS) markets. The Value Platform chipsets deliver accessible, affordable wireless to the global marketplace.

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