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NEC to showcase new high-end mobiles at 3GSM
Posted: 07-Feb-2006 [Source: NEC]

[NEC to display the world's thinnest 2.5G fold-type camera-phones, the N4121i and the N500iS EDGE-enabled phone, along with its prototype HSDPA handset developed with NTT DoCoMo.]

NEC Corporation (NEC) today announced that it will display a series of high-end mobile handsets including the world's thinnest 2.5G fold-type camera-phone, a prototype HSDPA 3G mobile phone and other end-to-end mobile solutions and handsets at 3GSM World Congress 2006, Barcelona.

The new HSDPA prototype, which was jointly developed by NEC and NTT DoCoMo for NTT DoCoMo's HSDPA commercial service, which is scheduled to begin within the second quarter of fiscal 2006, realizes a maximum data download speed of 3.6Mbps, a rate almost 10 times faster than that of present 3G terminals. This enables the download of large volumes of data and the browsing of rich contents, and is expected to realize a whole new and advanced range of uses in the future.

NEC will also display the world's thinnest 2.5G fold-type camera-phones N412i, and the latest model, N500iS (i-modeTM ). An EDGE function was added in the ultra-thin structure of the new model, enabling high-speed, real-time video streaming. The stylish model also features high-usability with a music player (MP3+AAC) boasting high quality sound and large capacity memory.

In addition, NEC will exhibit its latest handsets and end-to-end mobile solutions such as its digital terrestrial TV mobile phone and 3G/W-LAN dual mobile phone, contributing to the realization of future mobile multimedia applications.

NEC showcases these products behind its leading position in the global 3G and mobile internet market. At this year's 3GSM World Congress, NEC will unveil a selection of integrated products and services that show how NEC is adding value today to its customers by providing end-to-end solutions. NEC's booth illustrates network evolution, service solutions, customer value chain solutions, a product portfolio of network infrastructure and value added services, mobile handsets and semiconductor solutions.


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