|NAND Flash and LPTSDRAM in one package|
Posted: 23-Feb-2006 [Source: ST Microelectronics]
[ST Microelectronics announces a new multi-chip package combining NAND Flash and LPSDRAM making faster processing and lower power consumption possible for high demand multimedia applications on 3G mobile platforms.]
Geneva, Switzerland -- STMicroelectronics today announced a new MCP (Multi-Chip Package) memory portfolio designed to meet the needs of multimedia applications in 3G and CDMA mobile phones, and in other portable devices, where memory requirements are high and space and power are limited. The series offers memory densities up to 1-Gbit of NAND Flash with up to 512-Mbit of LPSDRAM (Low-Power Synchronous Dynamic RAM) in a single package, and has been developed in close cooperation with chipset enablers and operating system (OS) vendors to ensure that it matches the requirements of phone manufacturers and is compliant with the major mobile platforms.
Demand for multimedia applications on 3G phones is increasing rapidly, and today's models are capable of taking pictures, playing and capturing video, and web surfing. The requirements of advanced image and audio processing capability, faster throughput and greater storage is changing the phone's structure from a simple voice signal receiver and transmitter to a PC-like architecture that is more general-purpose and is able to recognize and properly use data for images, video and audio.
Multi-chip packages mount two (or more) chips in a single package to minimize the space required in critical applications, while increasing the memory density and offering the necessary different memory types. ST is a leader in MCP design and manufacturing technology, and has designed the new series to offer the widest range of NAND Flash and LPSDRAM combinations in one package, providing fast time-to-market and high design flexibility, and satisfying customers' differing handset memory requirements.
The new MCPs can be configured in many different ways to match a variety of specific applications: bus width, memory density, clock frequency and data rate can be configured to meet specific requirements. The NAND Flash and LPSDRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips.
ST's MCP options allow mobile phone makers to reduce the space requirement of their products -- following the miniaturization trend of the market -- and benefit from fast processing speed with low power consumption. The devices offer high memory density for storage of multimedia objects and have high data throughput. Other handheld applications include PDAs (Personal Digital Assistants) and GPS (Global Positioning System) units. All combinations are available now and offered in a range of BGA packages fully compatible with other devices available on the market.
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