Beceem Communications, a leading provider of chipsets for Mobile WiMAX technology, announced that the company has successfully performed rate 2 MIMO demonstrations exceeding an aggregate Downlink and Uplink throughput of 33Mbps. This performance was achieved at the Application Layer using Beceem's BCS200 wave 2 chipset and the infrastructure of a leading carrier-class OEM.
"Mobile operators are seeing data ARPU contribute to the top-line growth of revenue based on an increasing demand for mobile broadband connectivity, the delivery of audio / video, MMS and gaming," said David Patterson, vice president of Marketing for Beceem. "The BCS200's ability to exceed 33 Mbps throughput highlights the advantages of Beceem's WiMAX solutions to enhance these existing services by bringing a ubiquitous, DSL-like experience to a wide range of products such as WiMAX CPEs, Express cards, USB dongles, laptop PCs, mobile phones and other consumer electronics devices."
Beceem's BSC200 solution provides significant performance improvements that meet the launch requirements of WiMAX service providers focused on Wave 2. The BCS200 solution consists of:
* The BCSB200 baseband chip and associated firmware implements Physical Layer (PHY) and Media Access Control (MAC) functionality with minimum processing load for the host processor.
* The BCSR200 direct conversion CMOS radio supporting 2 GHz and 3 GHz designs, as well as dynamically programmable channel bandwidths from 5 MHz to 10 MHz thereby enabling seamless roaming among all WiMAX networks.
* A complete reference design kit including driver software and RF calibration tools, facilitates rapid development of Mobile WiMAX devices by OEMs and ODMs.
BCS200 chipset samples and reference design kits are immediately available.